Samyang(三养)TRIREX PC HS3025G10是一种GF强化,冲击补强聚碳酸酯，比重是1.25g/cm³，熔流率（熔体流动速率）(300°C/1.2 kg)13g/10min，有着优异的机械特性，很好的尺寸稳定性及良好的电气特性，应用于电子电器。
以下是PC(聚碳酸酯)HS3025G10/Samyang(三养)物性表参数
| PROPERTY | UNIT | ASTM METHOD | TYPICAL DATA |
|---|---|---|---|
| Physical | |||
| Specific Gravity | - | D792 | 1.25 |
| Water Absorption (24 hours at 23℃) | % | D570 | 0.12 |
| Melt Flow Rate (300℃, 1.2kg) | g/10min | D1238 | 13 |
| MECHANICAL | |||
| Tensile Strength at yield | kgf/㎠ | D638 | 600 |
| Tensile Elongation at break | % | D638 | 6 |
| Flexural Strength at yield | kgf/㎠ | D790 | 1,000 |
| Flexural Modulus | kgf/㎠ | D790 | 30,000 |
| Izod Impact Strength, notched, 23℃ (1/8”) | kgf∙㎝/㎝ | D256 | 14 |
| Rockwell Hardness | R scale | D785 | 121 |
| THERMAL | |||
| HDT, 18.6 ㎏f/㎠ | ℃ | D648 | 124 |
| Coefficient of Linear Thermal Expansion | ㎜/㎜/℃ | D696 | 3.2 x 10-5 |
| ELECTRICAL | |||
| Volume Resistivity | Ω∙㎝ | D257 | 4E+16 |
| Dielectric Strength | kV/㎜ | D149 | 19 |
| Dielectric Constant | - | D150 | 3.11 |
| Dissipation Factor | - | D150 | 0.0097 |
| ARC Resistance | sec | D495 | 120 |
| OTHERS | |||
| UL-94 Flammability (0.75mm thickness) | - | (UL 94) | HB |
| Mold Shrinkage (3mm thickness) | % | D955 | 0.2~0.4 |
※The figures listed in this table are typical values obtained under the standard test methods and may not be applicable for products that are under different application condition.
PROCESSING GUIDE FOR TRIREX® HS3025G10 GRADE
General processing conditions for TRIREX® HS3025G10 are shown below.
Drying prior to processing is essential to ensure desired appearance and property performance.
| SPECIFICATION | UNIT | CONDITIONS |
|---|---|---|
| Drying Temperature | ℃ | 120 |
| Drying Time | hr | 3~4 |
| Moisture Content, Max | % | 0.02 |
| Melt Temperature | ℃ | 310~330 |
| Nozzle Temperature | ℃ | 300~320 |
| Front Temperature | ℃ | 300~320 |
| Middle Temperature | ℃ | 290~310 |
| Rear Temperature | ℃ | 280~300 |
| Mold Temperature | ℃ | 80~110 |
温馨提示：本物性表参数提供者不承担任何法律责任，建议在选择材料前，就数据值与塑胶材料厂商进行验证。版权归原作者所有，如有侵权请立即与我们联系.
